conduction cooled vme chassis. Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C range. conduction cooled vme chassis

 
 Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C rangeconduction cooled vme chassis  As VXS is based on a 0

VITA 62 power connector. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. 1-1997 while providing a low profile, practical packaging solution for high-performance. Type 11 19" Embedded Card Cages from ELMA Electronic Inc. Air cooled, conduction cooled and liquid cooled options. VITA 62 power connector. Meets ARINC 404A and. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid VME64x/VITA46/48 VPX 5-slot Development System VME-VME64 6U 162 Series. Embedded RuSH Technology monitors Power Supply voltage and current on all 6-channels, plus temperature, and (optionally) humidity. The PSC-6238 front I/O. CompactPCI Serial Chassis. Test chassis can test up to 6 Conduction Cooled VME 6U cards. 3 VDC 75-Watt Converter 6U VME. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Terminal, 8 slots: On-board Schottky barrier diodes. Application. 8 in. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. Full environmental sealing insures reliable, all-conditions operation. 0 - 7. 88 in. Conduction cooling is defined as the transfer of heat through solids. 20 based. 3U Conduction Cooled VPX Extender with Fan Option. 62. 3) CompactPCI Serial is an industrial standard for modular computer systems. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Load boards convection or conduction cooled • Rear Transition Modules for I/O • Intel & Freescale Single Board Computers • Blade level networking boards (Ethernet, PCI Express) • Rackmount, desktop, and ATR chassis platforms • Ruggedization programs 6U 7-Slot OpenVPX Backplane BKP6-HYB07-11. • Drive Bay: None Installed. 5mm) to 1. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction cooling rather than utilizing active systems such as forced. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. 9 mm) Design Feature: Tolerance Compensating. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion. 64PS1 - North Atlantic Industries. VME / VME64x Chassis. Applying our years of rugged MIL-STD 810 and 461 design experience, our EPACK/S systems provide the highest degree of environmental rugged design with latest technologies of conduction-cooled, air. Extended Description. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. -199 in order to ensure interoperability and common good practices. Power Supplies. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. or 1. 100G Ethernet Data plane. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. VPX breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology. With moveable rear profiles (up to 2. Cooling: Conduction cooled. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. It can withstand extreme environmental conditions such as temperature, shock, vibration. sets itself apart from other rugged electronic packaging suppliers by specializing in engineered packaging solutions, primarily for military, heavy industrial and aerospace applications. 4 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Dimensions: 11. The convection bridge is clamped between the VME. Because VITA 48. VITA Conduction Cooled Assemblies, 6U260VITA48. This Model Can be used to design the VITA Card Chassis. Intelligent VPX Test Module, also System Monitor and Load Board. Permissible Current Load: 5V_VS3 0A. 64PS1 - North Atlantic Industries. Dawn VME Products 47915 Westinghouse Drive • Fremont, CA 94539 510-657-4444 Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments: airborne, land, and sea. (Table 3) The PCI sub-system can support from 2 to 9 PMCs within a standard VME chassis (see P0CC1 datasheet for more detail). pdf;Physical Characteristics. PSC-6234 3U 400-Watt 6-channel plug-in or bulkhead mounted Power Supply for conduction cooled OpenVPX systems. 8” pitch versus a typical 1. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. CompactPCI Serial Chassis. For ATR, 19” chassis and box solutions; VPX, VME, Compact PCI, VXI… Backplane as well as MOTS (Modifiable of the Shelf) carrier board solutions MIL-38999 connectors Conduction-cooled and air-cooled design Third party module integration; Development platforms space-saving modular design approach to provide the highest flexibility for the. Why We Are the Leaders in COTS FPGA-Based High Performance Computing. High Quality Chassis and Enclosures for 3/6U VPX and OpenVPX Applications. Related products. Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C range. 5A, -12V_AUX/1. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. Compliant with VITA 65 Specification. Rugged Conduction Cooled Assemblies and Modules. 2-16 VPX slots at 1” pitch. 10/. CompactPCI Serial Chassis. 0 specifications. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 10/11; Backplane conforms to VITA 1. ATR Size : Max 6U Slots : 1/2 Short : 5 : 1/2 Long : 5 :Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardDesigned for airborne UAV ISR applications, this test chassis includes a hybrid OpenVPX backplane. or 1. Five slots 3U VPX conduction cooled Chassis. Thanks to this standard, conduction cooled boards and chassis selected Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. CCG-6860 conduction-cooled card guide introduced by Dawn VME Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. Ordering Information: Dawn P/N 11-1017332-01. Introduction. High-Performance Cooling with 8 fans in Push/Pull. These rugged power supplies are available in 200W-1300W power configurations with. 8 in. Different slot counts dependant on slot pitch (0. pdfA VME Chassis will be between 1 and 21 slots (the maximum). The XPand1303 is a low-cost, flexible, development platform. Intel®. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. • Backplane Slots: 9 VME64x J1/J2 Slots. 3U CompactPCI 2. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. 3U/6U (VPX / cPCI/ VME) Backplane Options. 2, VITA 30. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of. 2-7. Conduction cooled ATR Chassis; Development Chassis; IEEE 1101. Tested to MIL-STD-810, VITA47. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 2. Advanced airflow design distributes air across external fins in sidewalls. from ELMA Electronic Inc. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Chassis Type: ATR Chassis Cooling: Forced Air Module Cooling: Conduction Number of Slots (1″ pitch): Various Operating Temp. 0 specification for use in Mil/Aero VPX systems. Thermal design, simulation and analysis services. The power supply is plugged into rear behind the fan tray. Aitech Defense Systems Inc. Card Thickness: 2. Experience with designing and developing of Embedded Systems of air cooled and conduction cooled (VME Chassis, ATR Chassis, ICC Chassis) for Defense and Aerospace, Industrial Automation Panels, Programmable Automation Controllers, and. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. Paper ID: SR22628105125 DOI: 10. (COTS), air or conduction cooled single stage converters according to the ANSI/VITA 62. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 1 PICMG 2. Shutdown control for each power rail. Compare. 1ϕ / 3ϕ AC or 28v DC Input power supply (up to 1500w) Input Transients as per MIL-STD-704E / MIL-STD-1275D. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. This rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. The ANSI VITA 62 standard defines the mechanical and electrical specifications for commercial-off the shelf plug-in power supply modules in 3U and 6U format. The standard model is conduction to wedge lock. 2 specification. 6"W x 9. Available in convection cooled (forced-air), conduction cooled , and hybrid versions. PXI /. Elma offers both standard and custom subracks for a wide variety of bus standards including VME, VME64x and VXI systems. The VPX3-663 combines a PCIe Gen 3. 0 specification for use in. 3) CompactPCI Serial is an industrial standard for modular computer systems. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Conduction cooling moves the heat from the printed board through a heat transfer surface to the chassis walls and structure where the air circulating nearby removes the heat. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Configuration: • System Power: 400W. 6U / VITA 62 / 580W. Chassis GND: Continuous chassis GND surface where backplane is mounted to rack, comes with M3 screw for chassis GND. Block Diagram. +70°C, ≤ 8 slots: -40°C. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. 3U CompactPCI. Convection, conduction and liquid cooled ATR enclosures support a wide-range of applications for Land, Air and Sea. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. The chassis houses a five-slot 6U VME64X backplane accommodating up to five top-loaded conduction cooled 6U VME boards, including power supply, and a 300W 28VDC plug in power supply that is MIL-STD-740D and MIL-STD-461C compliant. The PSC-6236 features a mission critical wide temperature range at high power on a 1 inch pitch. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. It is conduction-cooled through the card edge/wedgelock. Designed for mission critical applications. 8 in. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. Show More Description. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Get more information on our VME Processors, such as the 6U VME7555 and VME7653 from Orion Technologies on. 11 Slot SOSA Development System. An assortment of lab chassis with DSUB rear I/O, extenders and bus extenders round off the classic product line. Hartmann Electronic’s slimmest 19” rack mountable VME solution – The VME64x 1U system. Over the evolution of its near 40 years of existence, VME-bus has become a worldwide standard and is still used in a wide variety of applications across many different markets. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. Conduction-cooled builds are for use in. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. Operating at wire-speed, these networking modules can be used to architect a. as. VXS uses a straightforwardFPGA-Based VME Bridge; IPMI for VPX Systems; Cisco IOS-XE® Embedded Services Routing; Built-In Test (BIT) coreboot & FSP for Intel; Green Hills INTEGRITY. With PCI Express now the de facto on- and between-board “bus,” it’s more important than ever to debug signals and protocols. 31 in) / PCB + (7. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. A means to utilize conduction-cooled VME electronics mod ules in an air cooled system is provided. 3-n (Slots: 5 nodes, 1 storage, 1 switch) Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Description. The heat from the internal conduction-cooled. PXI Express Chassis. PXI Express Chassis. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. The mechanical design of VITA 48. 3V, 5V, +12V_Aux, -12V_Aux & 3. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. Aids in locating hot spots in the chassis. 5 Hz 20fe_ 0. Level 4-5 Conduction Cooled 1; Levels 1 through 3 and 5 – Air, Conduction Cooled 1;. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Chassis is capable to provide withstand Shock and Vibration defined by MIL-STD-810 as followed: - Shock: 40G in both Positive and. (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. or 1. PXI /. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. Input Transients as per MIL-STD-704E / MIL-STD-1275D. Grabcad 3U Vita Card. Dawn VME Products is committed to leadership in SOSA modules and infrastructure. 62”H; 1ATR ARINC 404A Tall/Long format Weight: TBD Electrical Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. January 3rd, 2021. 6U VPX & VME Systems. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. 2, AMC. Power Supplies. The VT874 provides three AMC mid-size slots that can accept any AMC. It supports up to two 0. January 25, 2021. They are low-power system-on-chip (SoC. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. 1 PICMG 2. RME-6430 7U 19” Rack Mount Enclosure for 3U VPX. Expansion adapter chassis using the Intel Thunderbolt 3 interface 1; IO Works Board Drivers 1; IRIG,. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beForm Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. Rugged Conduction Cooled Assemblies and Modules. Height: 10. CompactPCI Serial Chassis. SAS, SATA, Fibre. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. GS16. 3U Conduction Cooled VPX Extender. 1) modules. Top-to-bottom and front-to-rear cooled versions available. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1" pitch per VITA 65 Backplane Profile BKP6. Table top rubber feet. RuSH enhanced 3u conduction cooled power supply Wedge-lock style card guides to support conduction cooled boards available as an option. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. NAI’s 44KS2 is a 75-Watt DC/DC Converter that plugs directly into a standard 6U VME chassis with an 0. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardCan be provided in a range of ATR sizes. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. Visit Signal Generator. The CHAMP-XDx family of modules features some of the most sophisticated thermal frames yetW-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Description. PXI Express Chassis. CPCI Chassis. 0 in. The newest VITA specification is VPX. or 1. The ATR-5700 uses a microcomputer controlled 600W 6-Channel, VPX power supply that operates at 94% efficiency. 0 specification for use in Mil/Aero VPX systems. A&A Performance Chassis : 3352 Compton Rd. Advanced airflow design distributes air across external fins in sidewalls. The convection bridge is. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. Maximum power dissipation depends on cold plate. They can be used to power a VPX chassis and will fit into the. CompactPCI Serial Chassis. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a system’s card components. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems,. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Systems Integration Plus, Inc. 1, 1101. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice. Description: The Model 8006 is a conduction cooled Half-Short ATR chassis with a 4-slot VME 64x or cPCI backplane standard. Wire-free design. pitch conduction-cooled CompactPCI modules. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. 3U/6U Short/Short, Short/Long, Tall/Short, Tall/Long & Dwarf to 1 ½ ATR Chassis. 6U Conduction Cooled VPX Extender. 5 Air & Conduction-Cooled Ruggedization Levels Standard Features – 1 Megabyte (MB) L2 Cache with private L2 Bus (2 MB for 7410). VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. Operating temperature range: -40°C to +85°C. 3 V. Next news articleDawn’s VPX Development System for 6U OpenVPX boards aligns well with the requirements specified within Draft 1. or 1. Card Thickness: 2. The wedge locks are seated in card slots on the chassis, which . PXI /. The front load card orientation optimizes space efficiency, serviceability and cooling. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 8” slot. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. +85°C. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. {Tower-Desktop-Industrial-Rugged-[Military] to 901D} Extreme Engineering Solutions {VPX and CompactPCI Development Platforms, Deployed Systems, ATR, rugged, air- and conduction-cooled, Integrated Systems} Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. The heart of the C164 is Intel’s Broadwell platform, featuring a 5th Generation Intel® Core™ i7 Quad Core processor with integrated Intel® Iris™ Pro Graphics 6200, coupled with a companion Lynx Point. By leveraging low cost silicon and software developed for PCI, CompactPCI has become the world’s most popular modular open computer. 8-inch pitch backplanes. When integrated with wedgelocks and ejectors, this product allows VME, cPCI and other boards to fit within conduction cooled chassis slot dimensions with zero insertion force. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. View VPX Rugged SystemsDawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40 0 C to +85 0 C at the wedge lock edge. Find 6U VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of 6U VME Chassis information. LCR’s field proven chassis have provided over 30 years of reliable service in a wide array of. Environment: Extended Temperature, Extended shock & vibration : Height: 10. Even though conduction cooling typically is the least expensive thermal-management approach for rugged systems, it still introduces some costs in the form of metal card edges that conduct heat. Ideal for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U conduction cooled boards with a 1" pitch per VITA 48. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. Up to 128 Gbytes DDR4 memory for server grade applications. 3U cPCI/VPX Conduction-Cooled Turnkey Subsystem Download Datasheet View Product. Embedded RuSHTM technology. Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses;. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 3V_Aux. 66A steps, 3V3_VS2 0A. Curtiss-Wright Controls Embedded Computing announced the availability of conduction-cooled rugged versions of the company's popular CHAMP-FX digital signal processor (DSP) 6U VME64x and VITA-41 engines, making this dual-FPGA board ideal for demanding signal processing applications that require survivability in harsh environments. Elma’s line of rugged Air Transport Racks (ATRs) provide ideal cooling and reduced weight through superior. VITA46, VITA48 (VPX REDI) and VITA65 (Open VPX) ready accessories, backplanes, development chassis, power supplies, enclosures and rack mounts. Configure your VME SYSTEM. Ability to work with existing board, frame, or chassis designs. Verifies chassis can meet power requirement and specifications for VPX. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. They are designed for circuit boards. Item Description. Home. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. PXI Express Chassis. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. Optionally it can be outfitted with a rear transition card cages. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. The XPand1011 system is a low-cost development platform for conduction-cooled 6U VPX cards. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. Operating temperature range is -40°C to +85°C. 62H. PXI Express Chassis. – September 21, 2010 – Dawn VME Products, a leading designer and manufacturer of high performance and reliable embedded packaging technology products based on the VITATM and PICMG® architectures, announces its CCE-3VX4 ruggedized 4 slot conduction cooled enclosure for VPX 3U modules, the VPX. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 62H. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 8 slot conduction cooled 3U VPX chassis; 6 SSD removable drive bay; Minimal Cables / Edge Card; Multiple configurations, interfaces, and integrations. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. Folder. Product Type: Chassis. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. With moveable rear profiles (up to 2. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. 52”L x 7. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. SOSA™ Aligned Technology Capabilities Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses; Environmentally Sealed; Compact and Lightweight with 5 Standard VME64x Slots; Internally Conduction-Cooled; Externally Cold Plate Cooled; Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial high air flow 28V exhaust fan (can be powered with internal AC supplies) – less expensive option desired Liquid cooling, typically at the base, relying on conduction from chassis; Air cooling, using fins directly attached to the chassis sidewalls; HIK™ CARD FRAMES SOLVE THERMAL MANAGEMENT CHALLENGES. 87"W x 3. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. or 1. X-ES provides a line of high-performance, rapid-development 3U VPX Rugged COTS-Based Systems. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 3U Conduction cooled models available in 1″ form factor. VME 11; PCI Express 10; cPCI 3U 9; 3U VPX 8; Software 6; Thunderbolt 3 6; VXI 6; 3U 5; cPCI 6U 5; PCI 4; ISA 3; Mini PCI Express 3;. Air-Cooled variants are designed to be used in standard industrial VME chassis. 3U/6U (VPX / cPCI/ VME) Backplane Options. 8 (. An optional hold-up module will be available to support. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. 600-Watt DC/DC Converter, 6U VME. All conductive plates and surfaces are typically aluminum. Air Cooled. For all rugged environments: Air, Land, and Sea. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. Such means com prises a modified convection-cooled VME compatible chas sis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. CompactPCI Serial Chassis. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10. Air-Cooled Scroll Modular. The PSC-6265 operates continuously at a. The aim is to. The 9U, 12R2 is designed to meet the harsh environment of shipboard, airborne, and ground mobile applications per MIL-STD ’s. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. About - 1-ACT. Defense applications require a range packaging approaches. The chassis is cold plate base coupled conduction cooled. 8" &' 1. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Revolutionary design allows for up to 175 watts per slot of conduction cooling.